CircuitWorks Flux Pens
CircuitWorks Flux Dispensing Pens provide controlled and exact applications that are generally compatible with most materials in the electronics industry. Dispense flux on printed circuit boards, heat sinks, chip carriers, switches, sockets and much more.
CircuitWorks Flux Dispensing Pens are fast drying, completely portable and have minimal excess flux waste. Instant wetting action provides thorough deoxidation of metallic surfaces providing the best possible surfaces for hand soldering.
CircuitWorks Flux Pens are designed specifically to apply each type of flux with precision control:
- Rosin Flux Dispensing Pen quickly applies a noncorrosive type R flux. This flux meets MIL-F-14256 E and F.
- No Clean Flux Dispensing Pen precisely applies a patented noncorrosive, halide-free, organic low solid flux. This flux meets Bellcore TR-NWT-000078 and IPC SF-818 for surface insulation resistance.
- Lead-Free Flux Dispensing Pen quickly applies a noncorrosive, halide-free, No Clean flux which meets Bellcore TR-NWT-000078 and passes IPC SF-818 for surface insulation resistance.
- Water Soluble Flux Dispensing Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic water soluble flux compatible with most solder masks. The high activity organic product cleans easily with water, reducing cleaning cost.
CW8100 - ANSI/IPC SF-818, ANSI/IPC J STD-004, Type ROL0
CW8200 - MIL-F-14256F, Type R, ANSI/IPC J STD-004, Type ROLO
ANSI/IPC J STD-001, IPC-7711
|Shelf Life||5 yrs.|
|Shipping Name||Consumer Commodity ORM-D|
What flux should I use when replacing PCB components?
CircuitWorks® flux pens are available with a variety of fluxes to fit your specific shop requirements, including: no-clean, high temperature no-clean for lead-free soldering, rosin, and water soluble. Flux pens are an excellent way to dispense flux for benchtop soldering. You just hold the pen vertically and briefly depress the tip to start the liquid flow. This will saturate the tip of the pen with flux. Draw flux on the area to be soldered. Gently press the tip again when more flux is needed to keep the tip damp with flux.
Can I add my own flux to solder wick?
In a production or repair environment where the flux is specified and can’t be changed, or when an aqueous flux is needed, you can add your own flux to this type of braid. Unfluxed wick will not remove solder unless flux is added. Different types of fluxes are available in pen packaging, which is ideal for fluxing braid.
How do I figure out the shelf life of a product?
The shelf life of a product can be found on either the technical data sheet (TDS), available on the product page, or by looking on the certificate on conformance (COC). The COC can be downloaded by going to https://www.chemtronics.com/coc. Once you have the shelf life, you will need to add it to the manufacture date for a use-by date. The manufacture date can be identified by the batch number. The batch code used on most of our products are manufacture dates in the Julian Date format. The format is YYDDD, where YY = year, DDD = day. For example, 19200 translates to the 200th day of 2019, or July 19, 2019. This webpage explains and provides charts to help interpret our batch numbers: https://www.chemtronics.com/batch-codes.
Do you need to clean flux?
Yes, flux should be cleaned off of a printed circuit board (PCB) after soldering is completed. The following are the reasons to remove flux residues: Improve Aesthetic Appearance of PCB - If you are a contract manufacturer of PCB’s, the visual appearance of the board reflects on your work. A clear, greasy-looking residue around a solder joint may raise flags for your customer’s incoming QC inspectors. If the flux residue chars and forms spots on the solder joints, it may look like a true defect like a solder joint void or “blow hole”. If the flux residue is from a rework process, it acts as a fault tag in the rework area, calling attention to the work even if there shouldn’t be a concern. Improve Reliability of PCB - Reliability requirements are generally driven by the nature of the final product. For a disposable product like a computer keyboard, nobody loses their life if it stops working. In that case, an EMS supplier may use no-clean flux and forgo the cleaning process. On the other end of the scale, requirements for pacemaker electronics, where board failure could directly lead to death, are going to be much stricter. In that example, cleaning will be required after assembly and any subsequent rework, and the process will be thoroughly tested for effectiveness and repeatability. Long-life durable goods may fall somewhere in-between, with cleaning a requirement, but without the rigid testing and controls. Prevent Corrosion on Components and PCB - Flux residues left on electronic circuit boards are acidic. If they aren’t removed with a cleaning process, the residues can draw in ambient moisture from the air and lead to corrosion of component leads, and PCB contacts. Avoid Adhesion Problems with Conformal Coating - Most people understand that when painting something, the surface must be prepared so it is absolutely clean. Otherwise, the paint will quickly lift off the surface and peel off. The same logic applies to conformal coating, even when the contamination is from no-clean flux. “No-clean” refers to the amount of ionic material left after soldering. It has nothing to do with whether or not coating can stick to it. When there are flux residues left on the PCB before the coating process, it is common to see the coating lift or delaminate from the surface of the board. This is evident when the pockets are isolated around solder joints rather than the overall surface (the exception being the bottom of a wave soldered PCB). To make matters worse, coatings are generally semi-permeable, so breathe to a certain extent. Moisture can enter and soak into the flux residue, and potentially lead to corrosion. Prevent Dendritic Growth from Ionic Contamination - Polar or Ionic particles left from flux residue and other sources, when exposed to moisture from the ambient air and when current is applied, can link into a chain or branch called a dendrite. These dendrites are conductive, so form an unintended trace that cause current leakage or, over a longer period of time, even a short circuit. This is not as much of a concern for no-clean flux. No-clean flux contains minimal ionic material that is fully consumed when the flux is activated, or in other words, brought to soldering temperature. If all of the flux isn’t activated, like when you apply a lot of flux but only solder a small area, you still need to clean the PCB.